首页> 外文会议>Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th >Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly
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Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly

机译:ABAQUS / Explicit子建模技术在系统装配跌落仿真中的应用

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摘要

In this paper, an impact analysis procedure coupled with submodeling technique in ABAQUS/Explicit under version 6.3 was established. A nested submodeling technique was adapted from a system assembly level global model to an electronic package component (first level submodel) and then to a solder ball (second level submodel) in the drop simulation. As a demonstration, a dummy PWB board drop vehicle was first used to verify the proposed procedures using submodeling technique in ABAQUS/Explicit. The results show that in general, submodeling technique in ABAQUS/Explicit provides very positive solutions for displacements, stresses (strains) and accelerations. Then, based on the framework developed, this technique was implemented into system assembly drop simulation. The whole approach starts from an initial global linear analysis of the selected system assembly to identify component areas where the response to the loading is deemed vital. Then, these component areas are enhanced through remeshing and linear reanalyzing to determine crucial solder joint. Finally, the crucial solder joint is refined via remeshing and nonlinear reanalyzing.
机译:本文建立了一个影响分析程序,并在6.3版的ABAQUS / Explicit中结合了子建模技术。嵌套子建模技术从系统装配级别的全局模型改编为电子封装组件(第一级子模型),然后在跌落仿真中调整为焊球(第二级子模型)。作为演示,首先使用了虚拟PWB板下放车,以使用ABAQUS / Explicit中的子建模技术来验证所建议的程序。结果表明,总体而言,ABAQUS / Explicit中的子建模技术为位移,应力(应变)和加速度提供了非常积极的解决方案。然后,在开发的框架的基础上,将该技术实施到系统装配跌落仿真中。整个方法从对选定系统组件的初始全局线性分析开始,以确定对负载响应至关重要的零部件区域。然后,通过重新网格化和线性重新分析来确定关键的焊点,以增强这些组件区域。最后,通过重新定型和非线性重新分析来完善关键焊点。

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