aluminium compounds; gallium compounds; III-V semiconductors; wide band gap semiconductors; heterojunction bipolar transistors; millimetre wave bipolar transistors; thermal conductivity; semiconductor device reliability; semiconductor thin films; high electron mobility transistors; HEMT; HBT; mm-wave applications; atomic bonds; microwave devices; heterojunction bipolar transistor device; high electron mobility transistor device; wide band gap semiconductor; doping impurities; silicon carbide substrate; power density; power added efficiency; mm-wave frequency; room temperature; thermal conductivity; device reliability; GaN film; III-V transistors; III-V nitride materials; 293 to 298 K; 60 to 90 GHz; AlGaN-GaN; SiC;
机译:SciFab-毫米波应用的晶圆级异质集成InP DHBT / SiGe BiCMOS铸造工艺
机译:异质结双极晶体管(HBT)的MMiC功率放大器应用
机译:100 nm AlGaN / GaN HEMT在毫米波应用中的可靠性
机译:用于MM波应用的III-V晶体管(HEMTS和HBT)的进步
机译:N极GaN MIS-HEMTS具有氮化硅钝化MM波应用
机译:0.1μmAlGaN / GaN高电子迁移率晶体管(HEMT)工艺的改进大信号模型及其在W波段实用单片微波集成电路(MMIC)设计中的应用
机译:用于微波功率应用的砷化镓异质结双极晶体管(HBT)的研究
机译:用于mm-Wave应用的III-V晶体管