首页> 外文会议>Integrated Reliability Workshop Final Report, 2004 IEEE International >DRAM standby current failure: the influence of hot carrier degradation on voltage level-up shifter circuit
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DRAM standby current failure: the influence of hot carrier degradation on voltage level-up shifter circuit

机译:DRAM待机电流故障:热载流子退化对升压转换器电路的影响

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In this report, the phenomenon of standby state current failure of dynamic random access memory (DRAM), which incorporates a low voltage to high voltage CMOS level-up shifter, was investigated. As a result, DRAM standby current failure due to on/off time delay of the level shifter circuit has been identified as being responsible for n-MOSFET ON-state current decrease by hot carrier injection (HCI).
机译:在本报告中,研究了动态随机存取存储器(DRAM)的待机状态电流故障现象,该现象结合了低压至高压CMOS电平上移器。结果,由于电平转换器电路的开/关时间延迟而导致的DRAM待机电流故障已被识别为造成通过热载流子注入(HCI)降低n-MOSFET导通状态电流的原因。

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