首页> 外文会议>Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on >On the surface stability of UV-cured InP-InGaAs HBTs using polyimide for passivation
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On the surface stability of UV-cured InP-InGaAs HBTs using polyimide for passivation

机译:用聚酰亚胺钝化的紫外光固化InP-InGaAs HBT的表面稳定性

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The stability of UV-cured devices was studied concerning the transient effect. The experimental results indicate that the transient behavior suppressed by UV-irradiation could be re-activated during device operation if the device is operated with high power. The current transient re-activated during the device operation could be directly related to the device self-heating through thermal annealing effect - a significant increase PI trap density as well as the broadening of spatial electron trap distribution in PI annealed at high temperature. Properly design the device structure and layout with better thermal management to ensure a low junction temperature is necessary for PI-passivated InP HBTs.
机译:关于瞬态效应,研究了紫外线固化器件的稳定性。实验结果表明,如果设备以高功率运行,则在设备运行期间可以重新激活受紫外线辐射抑制的瞬态行为。器件工作期间重新激活的瞬态电流可能与通过热退火效应引起的器件自热直接相关-显着提高了PI陷阱密度以及在高温下退火的PI中空间电子陷阱分布的扩大。正确设计具有更好热管理的器件结构和布局,以确保PI钝化InP HBT必须具有较低的结温。

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