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Packaging and board assembly technology trend and impact on the supply chain

机译:包装及板组装技术趋势及其对供应链的影响

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摘要

The development and implementation of packaging and assembly technologies to enable continued miniaturization, functional densification and integration, as well as environmental friendliness, have specific and direct impact on the supply chain, including packaging, board assembly materials, processes and equipment. Fast time-to-market requirement, in combination with low cost and high reliability needs for different product categories, demands ever increasing cooperation throughout the supply chain, with early visibility.
机译:包装和装配技术的开发和实施,以实现持续的小型化,功能致密化和集成以及对环境友好,对包括包装,电路板装配材料,工艺和设备在内的供应链产生了特定而直接的影响。快速的上市时间要求,以及对不同产品类别的低成本和高可靠性需求,要求在整个供应链中不断增强的合作以及早期可见性。

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