Reliable printed wiring board assembly and related assembly technology using packages with solder joints

摘要

An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package.