ball grid arrays; chip scale packaging; impact testing; circuit reliability; transient response; plastic packaging; finite element analysis; fine-pitch technology; reliability prediction models; fine-pitch BGA; drop-impact; portable electronic products; explicit finite element models; transient dynamics; printed circuit boards; smeared property formulations; reduced integration element formulations; shell elements; solid elements; transient-dynamic response; in-situ strain; deformation kinematics; plastic ball-grid arrays; tape-array BGA; QFN; C213GA; chip scale package; drop reliability; flex-substrate packages; controlled drop; failure modes; computational efficiency;
机译:冲击和跌落冲击下的细间距BGA和CSP的可靠性预测模型
机译:有限元建模,以分析热冲击期间BGA / CSP连接的耐久性
机译:使用退化规律模型和技术参数偏差估算BGA和CSP组件的可靠性
机译:细间距BGA和CSP在电击和跌落冲击中的可靠性模型
机译:研究用于倒装芯片,BGA和CSP应用的可热修复的底部填充胶。
机译:考虑载荷顺序影响的BGA热疲劳寿命预测模型
机译:BGA / CSP的包装技术。磁带型BGA / CSP技术。
机译:加速热循环和失效机理BGa和Csp组件