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Step-based facet interactions in wet anisotropic etching

机译:湿法各向异性蚀刻中基于阶梯的小面相互作用

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摘要

Recent experimental data has shown that a model of wet anisotropic etching of silicon must not be solely based on the crystal features presented to the etchant. The boundaries of under-etched facets, and step interaction at those boundaries, are also likely to play a role in determining etch rates. This work examines the behaviour of a particular configuration of steps, where both are composed of atoms having two dangling bonds, and where they intersect at an angle of 90/spl deg/, at a junction between two adjacent under etched facets.
机译:最近的实验数据表明,湿法各向异性蚀刻硅的模型不能仅基于呈现给蚀刻剂的晶体特征。蚀刻不足的小平面的边界以及在这些边界处的阶跃交互作用也可能在确定蚀刻速率中起作用。这项工作检查了特定步骤配置的行为,其中两个步骤均由具有两个悬空键的原子组成,并且在两个相邻的下蚀刻小平面之间的交界处以90 / spl deg /的角度相交。

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