首页> 外文会议>IPC printed circuits EXPO >Conductive Anodic Filament Growth Failure
【24h】

Conductive Anodic Filament Growth Failure

机译:导电阳极丝生长失败

获取原文

摘要

With increasing focus on reliability and miniaturized designs. Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit board (PCBj susceptible to conductive anodic filament growth. Isola has carried out work to characterize the CAF susceptibility of various resin systems under different process and design conditions. Tests were carried out to determine the effect of various factors such as resin systems, glass finishes, voltage bias and hole and line spacirngs on the CAF resistance. This work was intended to provide information to the user on the suitability of various grades for specific end use applications. The focus of the work at Isola is to find the right combination of process and design conditions for improved CAF resistant products.
机译:随着对可靠性和小型化设计的日益关注。导电阳极丝(CAF)作为故障机理正引起广泛关注。较小的几何形状使印刷电路板(PCBj)容易受到导电阳极丝生长的影响。Isola已开展工作,以表征在不同工艺和设计条件下各种树脂体系的CAF敏感性。进行了测试以确定各种因素的影响,例如树脂体系,玻璃表面处理,电压偏置以及CAF电阻上的孔和线间距问题这项工作旨在为用户提供各种等级的产品用于特定最终用途的适用性的信息。工艺和设计条件的正确结合,以改善耐CAF产品。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号