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ESD in electronic equipment: coupling mechanisms and compliance testing

机译:电子设备中的ESD:耦合机制和一致性测试

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The paper analyses several ways for an electrostatic discharge (ESD) to produce an effect on electronic equipment. In particular, they are classified into direct and indirect coupling mechanisms, also following the standard rules for compliance testing. A direct coupling arises when the discharge occurs on the equipment enclosure or on cables, that penetrating the shield, lead the ESD current on PCB traces and components. On the other hand, a distant ESD produces an indirect coupling by its strong radiated field, which impinges on the equipment. Particularly dangerous are those discharges occurring inside the shielding enclosure: in this case the radiated field directly couples with the internal electronics, and is enhanced by the resonant behaviour of the enclosure itself. Each situation is treated. from a theoretical point of view, adopting the more efficient technique: circuital approach, frequency or time domain numerical methods, and hybrid techniques. All simulations are experimentally confirmed showing a satisfactory agreement.
机译:本文分析了静电放电(ESD)的几种方式,以产生对电子设备的影响。特别是,它们分为直接和间接的耦合机制,也遵循合规性测试的标准规则。当放电发生在设备外壳或电缆上时,产生直接耦合,这引入了PCB迹线和部件上的ESD电流。另一方面,远端ESD通过其强烈的辐射领域产生间接耦合,从而撞击设备。特别危险的是在屏蔽外壳内发生的排气:在这种情况下,辐射的场直接与内电子器件耦合,并且通过外壳本身的谐振行为增强。每种情况都得到治疗。从理论的角度来看,采用更高效的技术:电路方法,频率或时域数值方法和混合技术。所有模拟都是通过实验证实的,表明令人满意的协议。

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