首页> 外文会议>Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th >0.1 /spl mu/m InP HEMT devices and MMICs for cryogenic low noise amplifiers from X-band to W-band
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0.1 /spl mu/m InP HEMT devices and MMICs for cryogenic low noise amplifiers from X-band to W-band

机译:适用于从X波段到W波段的低温低噪声放大器的0.1 / spl mu / m InP HEMT器件和MMIC

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We present the TRW 0.1 /spl mu/m InP HEMT MMIC production technology that has been developed and used for state-of-the-art cryogenic LNA applications. The 0.1 /spl mu/m InP HEMT devices typically show cutoff frequency above 200 GHz and transconductance above 1000 mS/mm. Aspects of device design and fabrication are presented which impact important parameters including the InP HEMT device gain, gate leakage current, and parasitic capacitance. One example of state-of-the-art cryogenic MMIC performance is a W-band cryogenic MMIC LNA operated at 20 degrees Kelvin that shows above 23 dB gain and a noise temperature of 30 to 40 K (0.45 to 0.6 dB noise figure) over the band of 80-105 GHz.
机译:我们介绍了TRW 0.1 / spl mu / m InP HEMT MMIC生产技术,该技术已开发并用于最先进的低温LNA应用。 0.1 / spl mu / m InP HEMT器件通常显示出200 GHz以上的截止频率和1000 mS / mm以上的跨导。介绍了器件设计和制造的各个方面,这些方面会影响重要的参数,包括InP HEMT器件增益,栅极泄漏电流和寄生电容。最先进的低温MMIC性能的一个示例是在20开氏温度下工作的W波段低温MMIC LNA,其增益超过23 dB,并且在整个温度范围内的噪声温度为30至40 K(0.45至0.6 dB噪声系数) 80-105 GHz频段。

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