Optoelectronics Multichip Module Packaging Technology under the Electronics System Integration Technology Research Project in Japan

摘要

Japan's five-year Electronics System Integration Technology Research project, started in August 1999, is developing a Tbit/s-order optoelectronic, three-dimensional packaging subsystem. This paper describes the technical approach taken and the progress made towards optoelectronics multichip module packaging technology with a throughput of over 100 Gbit/s.