首页> 外文期刊>IEEE journal of selected topics in quantum electronics >Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array
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Packaging Technology for Ultra-Small Variable Optical Attenuator Multiplexer (V-AWG) With Multichip PLC Integration Structure Using Chip-Scale-Package PD Array

机译:采用芯片级封装PD阵列的具有多芯片PLC集成结构的超小型可变光衰减器多路复用器(V-AWG)的封装技术

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摘要

We have developed an ultra-small 16-channel variable optical attenuator (VOA) multiplexer (V-AWG) with excellent optical performance by using multichip planar lightwave circuit (PLC) integration technology. The insertion loss is 3.2 dB, and the polarization-dependent loss (PDL) at 25 dB attenuation is less than 0.3 dB. The module size is 90 mm$,times,$55 mm$,times,$14 mm. We describe our concept and developed techniques as regards to the design, fabrication, and packaging of the module, focusing particularly on a chip-scale-packaged monitor photodiode array (CSP-PD) that we developed as a key component of our technique.
机译:通过使用多芯片平面光波电路(PLC)集成技术,我们开发了具有出色光学性能的超小型16通道可变光衰减器(VOA)多路复用器(V-AWG)。插入损耗为3.2 dB,衰减为25 dB时的偏振相关损耗(PDL)小于0.3 dB。模块尺寸为90毫米×55毫米×14毫米。我们描述了有关模块的设计,制造和封装的概念和开发的技术,尤其着重于芯片级封装的监控光电二极管阵列(CSP-PD),这是我们技术的关键组成部分。

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