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Silicon interlayer-based oxide-free surface passivation of InP and its application to MISFETs

机译:InP的硅中间层无氧化物表面钝化及其在MISFET中的应用

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Novel silicon interlayer-based oxide-free surface passivation is described and applied to fabrication of metal-insulator-semiconductor field effect transistors (MISFETs). Surface quantum states formed in the band lineup of SiN/sub x//SL/InP were pushed away by the quantum confinement effect by reducing the Si interlayer thickness down to about 5 /spl Aring/. Formation of the desired interface structure was confirmed by X-ray photoelectron spectroscopy (XPS) measurement. Ultrahigh vacuum (UHV) contactless capacitance-voltage (C-V) measurement was used for optimization of the process. InP surface after in situ passivation using the Si interlayer realized a full swing of Fermi level almost over the entire bandgap. The fabricated MISFETs with the Si interlayer-based passivation exhibited excellent gate control capability and stable operation with a low gate leakage current. The drift of the drain current was found to be as small as 1.9% after 10/sup 4/ s operation.
机译:描述了新型的基于硅中间层的无氧化物表面钝化并将其应用于金属绝缘体半导体场效应晶体管(MISFET)的制造。通过将Si中间层的厚度减小到大约5μg/ spl Aring /,通过量子限制效应将在SiN / sub x // SL / InP的能带阵容中形成的表面量子态推开。通过X射线光电子能谱(XPS)测量确认了所需界面结构的形成。超高真空(UHV)非接触电容-电压(C-V)测量用于优化工艺。使用Si中间层进行原位钝化后的InP表面几乎在整个带隙上实现了费米能级的全幅摆动。具有Si中间层钝化层的MISFET具有极好的栅极控制能力和稳定的操作,且栅极漏电流低。发现在10 / sup 4 / s操作后,漏极电流的漂移小至1.9%。

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