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A novel NMOS transistor for high performance ESD protection devices in 0.18 /spl mu/m CMOS technology utilizing salicide process

机译:采用自对准硅化物工艺以0.18 / spl mu / m CMOS技术用于高性能ESD保护器件的新型NMOS晶体管

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The electrostatic discharge (ESD) threshold of fully salicided grounded-gate NMOS transistors (ggNMOSTs) and partially salicided ggNMOSTs consisting of dummy-gate and N-well resistor was studied by transmission line pulse (TLP) I-V curves, and HBM and machine model (MM) robustness. The state-of-the-art 0.18 /spl mu/m cobalt salicide CMOS process is used, and the thickness of the gate dielectric material is 35 /spl Aring/. Fully salicided ggNMOSTs have much lower values of second breakdown current (It2) than partially salicided ggNMOSTs, and with multi-finger structures, only partially salicided ggNMOSTs turn on uniformly. Using these partially salicided NMOSTs as protection devices, we acquired ESD immunity of <2 kV (HBM) and <200 V (MM).
机译:通过传输线脉冲(TLP)IV曲线,HBM和机器模型( MM)健壮性。使用最先进的0.18 / splμm/ m的硅化钴钴CMOS工艺,栅极介电材料的厚度为35 / spl Aring /。与部分自对准的ggNMOST相比,完全自对准的ggNMOSTs的第二击穿电流(It2)值要低得多,并且具有多指结构,只有部分自对准的ggNMOSTs才能均匀导通。使用这些部分自杀的NMOST作为保护器件,我们获得了<2 kV(HBM)和<200 V(MM)的ESD抗扰度。

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