Theoretical calculations and experimental analysis on the effect of material properties of the die attach adhesive on stress in modeled plastic packages

摘要

Package failure caused by residual mechanical stress is a mjaor concern when an electrnic package is designed, manufactured and tested. The sources of residual stress are thermal stress, curing stress and stress induced by moisture absorption. As temperature chages during processing and service, thermal stress is introduced into a package because of CTE (coefficient of thermal expanison) differences between package components. Plymer components in a package have much higher CTE than other components like silicon die and the metal leadframe.