Conductive lithographic films are an emerging fabrication process for electronic circuits and systems. This paper reviews the manufacture and properties of CLF conductors, and describes a series of experiments to characterise bonds formed between them and surface-mount-technology (SMT) component packages employing electrically conductive adhesives. The purpose of this work is to directly compare the characteristics of solder joints between SMT packages on screen-printed alumina substrates, and conductive adhesive bonds formed between similar components and CLF substrates. The principal failure mechanisms of film-adhesive bonds in shear on various polymer substrate materials are identified and statistical data on bond strengths presented.
展开▼
