首页> 外文会议>Electron Devices Meeting, 1999. IEDM Technical Digest. International >Low voltage tunneling in ultra-thin oxides: a monitor for interface states and degradation
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Low voltage tunneling in ultra-thin oxides: a monitor for interface states and degradation

机译:超薄氧化物中的低压隧穿:界面状态和降解的监测器

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In this paper we report data on NMOS devices with ultra thin oxide (t/sub ox/=2 nm) and heavily doped substrates, showing, for the first time, that the gate current, for very low biases (-|V/sub FB/|>V/sub G/>0) cannot be explained by direct tunneling, but features an additional component which we attribute to gate electron tunneling into the anode interface states. Comparing measurements with simulations it is shown that this extra current can be used to estimate the interface states (D/sub it/) and to monitor oxide degradation in ultra thin oxides where the traditional stress induced leakage current due to bulk traps (SILC) is not detectable.
机译:在本文中,我们报告了具有超薄氧化物(t / sub ox / = 2 nm)和重掺杂衬底的NMOS器件的数据,这首次显示了栅极电流具有非常低的偏置(-| V / sub FB / |> V / sub G /> 0)不能用直接隧穿来解释,而是具有一个附加成分,我们将其归因于栅极电子隧穿进入阳极界面态。将测量结果与仿真结果进行比较,结果表明,该额外电流可用于估算界面态(D / subit /)并监控超薄氧化物中的氧化物降解,在超薄氧化物中,传统的应力诱发的漏电流是由体陷阱(SILC)引起的。无法检测到。

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