Palladium surface finishes are utilized for leadframe, printed wiring board, and automobile sensor applicatins. Their superior functial eprformace and the considerable enviromental impact of utilizign lead-free finishes for packageing processes have been increasingly reocgnized by the electronic industry. Wirebondable and solder able palladium finishes meet military and industrial standards at no extra cost in the overall assembly processes when ocmpared to traditioal packaging techniques. Along with developing palladium finishing chemistries and technologies, we have also investigated palladium wirebonding. In this study, we tested gold and aluminum wire bonding to palladium and examined wire pull force and break position in order to optimize the process. In this paper, we will report the results of this study.
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