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Pulsed plasma synthesis of low-dielectric constant materials

机译:低介电常数材料的脉冲等离子体合成

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The utility of a variable duty cycle, pulsed plasma polymerization technique low dielectric constant materials (k<2.3) is described. The molecular compositions (and thus the dielectric constants) of the plasma polymers are controllable via changes in the plasma duty cycles employed during synthesis, all other reaction variables being held constant. In the present study, this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers. The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased. Although the as deposited films exhibit relatively poor thermal stability, it was discovered that post-plasma annealing of the films, particularly at 400 deg under N_2, provides dramatic improvements in the thermal stability of these materials. Most importantly, this enhanced thermal stability is achieved with relatively minor changes in the dielectric properties of these materials. In fact, synthesis of high thermal stability films having k<2.0 is demonstrated in this work using the perfluoroaromatic monomer perfluoroallyl benzene.
机译:描述了可变占空比,脉冲等离子体聚合技术,低介电常数材料(k <2.3)的实用性。等离子体聚合物的分子组成(以及因此介电常数)可通过合成过程中所使用的等离子体占空比的变化来控制,所有其他反应变量保持恒定。在本研究中,用两种氟代芳族单体说明了在脉冲条件下的这种组成可控性。膜的介电常数随着聚合期间使用的等离子体占空比的降低而降低。尽管所沉积的膜表现出相对差的热稳定性,但是发现膜的等离子体后退火,特别是在N 2下400度时,对这些材料的热稳定性提供了显着的改善。最重要的是,通过这些材料的介电特性的相对较小的变化即可实现这种增强的热稳定性。实际上,使用全氟芳族单体全氟烯丙基苯证明了k <2.0的高热稳定性膜的合成。

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