Reliability daa for flip chip on flex

摘要

Advanced devleopments in interconnect technology are driven by fierce competition in various segments of semiconductor applications. New package schemes evolved to address aggressive requirements set forth by customers. Only during the past few years, has flip chip technology been accepted by general electronic industry as a true solution to many current and future applications. In the present work, it will be demonstrated that flip chip on flex is a reliable technology in hard disk drive applications. Reliability data will be presented demonstrating zero failures in dynamic life, thermal cycling, latch-up, electrostatic discharge, protective overcoat integrity, corrosion/delamination, and solder ball shear testing. The reliability data obtained met customer requirements. Hence, parts were qualified and used in production. This work demonstrated the high quality of both bumping process as well as the assembly process on flex substrates.