2D vision inspection requirements for chip scale packages

摘要

As Ball Grid Array (BGA) is embraced by the Semiconductor Industry as the device packaging methodology of the future, package sizes have rapidly begun to shrink. Chip Scale Package (CSP) devices meet the current industry requirements for improved performance to size ratio. CSP devices, typically 1.2 times the size of the silicon die itself, bring with them a new set of issues related to assembly yield and product reliability.