Chip scale package for detecting open/short of elcectrode pettern using noncontact inspection method and the inspection apparatus thereof

摘要

PURPOSE: A chip scale package for detecting open/short of electrode pattern using a noncontact inspection method and an inspection apparatus thereof are provided to inspect the short circuit and the disconnection of a corresponding pattern electrode by detecting an electrical signal through an electric field sensor. CONSTITUTION: A short circuit and disconnection device using a contactless inspection method is comprised of a probe electrode(10), a feeding unit(20), and a contactless inspection unit(30). The short circuit and disconnection device scans a plurality of pattern electrodes on a panel and inspection the short circuit and disconnection of each pattern. The probe electrode applies voltage to a pattern electrode on one side of a substrate. The feeding unit supplies power to the probe electrode. The contactless inspection unit measures electrical change which is generated from the backside of a pattern electrode through a contactless method.