Silicon bulk micromachining which is based on a silicon etching and glass-silicon anodic bonding plays important roles to make micro sensors and micro actuators. Three dimensional microfabrication of other functional materials as piezoelectric materials are also important to develop high performance microactuators, micro energy source and and so on. Vacuum sealing is required to prevent a viscous dumping for packaged muicromechanical sensros. Extremely small strctures as microprobe are required for high resolution, high sensitivity and quick response. As sophisticated microsystems which are made of many sensors, circuits and actutors are required for example for maintenance tools used in a narrow space. Developments for these requirements will be described.
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