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Strong correlation between interface microstructure and barrier height in n-InP Schottky contacts formed by in situ electrochemical process

机译:原位电化学过程形成的n-InP肖特基接触中界面微观结构与势垒高度之间的强相关性

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InP and related materials are attractive materials for high speed electronic and optoelectronic devices. Technologically, well-controllable metal/semiconductor (M/S) interface with high Schottky barrier heights (SBHs) in nano-scale are required for the realizability and the high reliability of nano-scaled electronic devices. However, metal-InP contacts generally produces low SBH values of typically about 450 meV. SBH values cannot be increased by using contact metals with large work functions due to so-called Fermi-level pinning. In contrast to this, we have recently shown that the SBH value of the Pt-InP contacts can be increased up to 860 meV by using an in situ pulsed electrochemical process. This process has also been shown to be useful for the Schottky gate formation for MESFETs and HEMTs. The purpose of this paper is to optimize the electrochemical process for high SBHs by investigating the correlation between the microstructures of metal-InP interfaces having nano-scale metal particles and the SBHs.
机译:InP和相关材料是用于高速电子和光电设备的有吸引力的材料。从技术上讲,纳米级电子设备的可实现性和高可靠性要求在纳米级具有高肖特基势垒高度(SBH)的可控金属/半导体(M / S)界面。但是,金属/ n-InP触点通常会产生低SBH值,通常约为450 meV。由于所谓的费米能级钉扎,使用功函数较大的接触金属无法提高SBH值。与此相反,我们最近显示,通过使用原位脉冲电化学过程,Pt / n-InP触点的SBH值可以提高到860 meV。该工艺也已证明对于形成MESFET和HEMT的肖特基栅极很有用。本文的目的是通过研究具有纳米级金属颗粒的金属/ n-InP界面的微结构与SBHs的相关性来优化高SBHs的电化学工艺。

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