A fast 3D modeling approach to parasitics extraction of bonding wires for RF circuits

摘要

An approach to fast 3D modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the frequency response of bonding wires. To verify simulation accuracy, test structures have been designed and measured. Excellent agreement between simulated and measured data is demonstrated up to 10 GHz.