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The impact of field plate resistivity on the performance of a novel high voltage thin film transistor incorporating a semi-insulating layer

机译:场板电阻率对包含半绝缘层的新型高压薄膜晶体管性能的影响

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摘要

The Semi-Insulating field plated High Voltage TFT (SI HVTFT) is a new poly-Si HVTFT structure with a much improved blocking capability and enhanced on-state performance [1][2].The unique feature of the SI HVTFT is the semi-insulating amorphous oxygen-doped Si (SIAOS) field plate which connects the gate to the drain and reshapes the potential distribution in the offset region.The leakage current,flowing through the SIAOS field plate during device operation,determines device performance.In this paper, both experimental and 2-DS simulation results for devices with different field plate conductivifties are used to investigate the impact of the field plate properties on the performance of the SI HVTFT structure.
机译:半绝缘场镀高压TFT(SI HVTFT)是一种新型的多晶硅HVTFT结构,具有更高的阻断能力和增强的通态性能[1] [2]。SIHVTFT的独特之处在于半绝缘的非晶氧掺杂Si(SIAOS)场板将栅极连接到漏极,并重整偏置区域中的电势分布。在器件工作期间流过SIAOS场板的泄漏电流确定了器件的性能。 ,使用具有不同场板电导率的器件的实验结果和2-DS仿真结果均用于研究场板特性对SI HVTFT结构性能的影响。

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