Rapid thermal processing: when will it replace batch processing?

摘要

Rapid Thermal Processing (RTP) is currently well established at the <0.5 um m nodes for implant anneal and silicide formation/anneal in logic applications.Rapid Thermal Chemical Vapor Deposition (RTCVD) is being evaluated to deposit thin nitride for the DRAM storage node dielectric.A combination RTP/RTCVD has been evaluated in the form of a cluster tool to evaluate 60 A gate oxides.These applications of RTP are considered to be process enabling because of either improved temperature ramp control or ambient control which are not available in batch processing.However,even with these specialized applications,rapid thermal processing comprises less than 20