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Dislocation behaviour in strained layer interfaces

机译:应变层界面中的位错行为

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摘要

The origin and energetics of misfit dislocations in interfaces between misfitting layers are reviewed. Experimental results on the distribution of misfit dislocation (MD) spacings in GaAs-based systems reveal the random nucleation behaviour of MDs and the gradual evolution of populations of 90 deg edge dislocations. Etch pit results indicate that dislocation multiplication becomes significant only when strained layers exceed a thickness of 4h_c. The contribution of MDs to the formation of cross-hatch is clarified by observations of layers grown on vicinal substrates.
机译:回顾了失配层之间界面失配位错的起源和能量学。在基于GaAs的系统中错配位错(MD)间距分布的实验结果揭示了MD的随机成核行为以及90度边缘位错的种群逐渐演化。腐蚀坑结果表明,仅当应变层的厚度超过4h_c时,位错倍增才变得重要。通过观察在邻近基底上生长的层,可以清楚地看出MD对交叉影线形成的贡献。

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