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Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC'S

机译：在塑料封装IC'S的高温存储寿命（HTSL）测试中外推到较低温度的问号

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《Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on》|1996年|P.1935-1938|共4页
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Schuddeboom W.; Wubbenhorst M.;
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中图分类无线电电子学、电信技术;
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