首页> 外文会议>Reliability of Electron Devices, Failure Physics and Analysis, 1996. Proceedings of the 7th European Symposium on >A new method to determine the influence of thermomechanical stress on the reliability of metal lines in integrated circuits
【24h】

A new method to determine the influence of thermomechanical stress on the reliability of metal lines in integrated circuits

机译:确定热机械应力对集成电路中金属线可靠性影响的新方法

获取原文

摘要

The influence of thermomechanical stress on the reliability of metal lines produced of different aluminium alloys was investigated using a new simple method. The samples were treated through temperature cycling from -65/spl deg/C to +160/spl deg/C. Two different electrical test methods were then applied and the data were compared to determine a possible change in the electrical stressability due to the temperature treatment. A big difference was observed in the results from AlSiCu and AlCu metal lines.
机译:使用一种新的简单方法研究了热机械应力对不同铝合金生产的金属线的可靠性的影响。通过从-65 / spl deg / C到+ 160 / spl deg / C的温度循环处理样品。然后应用了两种不同的电测试方法,并对数据进行了比较,以确定由于温度处理而引起的电应力的可能变化。在AlSiCu和AlCu金属线的结果中观察到很大的不同。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号