Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs

摘要

The relation between yield and early failures as encountered in the field was investigated with several high volume IC's manufactured in several processes. A clear correlation between yield and reliability was found that obeys a simple model. The model also provides the ability to predict the FIT or PPM level of a given IC based on its yield. Using these results we illustrate how a wafer fab may improve the reliability level of its products in a controlled way.