A universal reliability prediction modle for SMD integrated circuits based on field failures

摘要

This paper makes a review of integrated circuit filed failures on three types of environment respectively, Ground Benign (G_B), Ground Fixed (G_F), and Airborne Inhabited Cargo (A_IC). It appears that for permanent working G_B, there was no package related failures and 2/3 of the failures had EOS origin. For G_F and A_IC most of the failures were open balls bonds and open solder joints. A universal predicting reliabiltiy model is therefore proposed for the die part and for the package part. This study has been carried out in the frame fo a working group, to update the French standard UTEC 80810(ex RDF93 from CNET), and is an alternative guide to the obsolete MIL-HDBK-217F for predicting reliability calculations.