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24'x 20' precision photomasks manufacture

机译:24“ x 20”精密光掩模的生产

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Abstract: Large area masks (LAMs) and 1X lithography are being used in the manufacturing of large area electronic devices. Some of these devices include, but are not limited to: flat panel displays (FPDs), active matrix liquid crystal displays (AMLCDs), electroluminescent flat panel displays (ELFPD), plasma display panels (PDPs), multichip modules (MCMs), and advanced interconnect systems. The use of LAMs along with 1X lithography reduces the cost of manufacturing these types of devices. However, there are several challenges in the manufacturing of LAMs. The first challenge is the lack of large area, quality substrates with quality coatings. The different types of substrates and the coatings presently available for large area photomasks are reviewed. The second challenge comes in dealing with the limitations of commercially available exposure systems used in writing LAMs. In this paper, we present an overview of several exposure systems, now available, and their resolution capabilities. The third challenge is the lack of availability of systems for the processing of photomasks larger than 14' by 14'. Processing systems for manual and automatic plate loading are also discussed. The final challenge to manufacture LAMs is inspection and quality certification. Presently, there is a void of commercially available metrology tools that can be used to measure and quantify defects on LAMs. Metrology techniques available for certifying finished LAMs are discussed along with their quality assurance capabilities. Current LAMs availability and specifications are also presented including LAMs with active areas as large as 20' by 18' (508 by 450 mm) and CDs of 2.0 micrometer. !8
机译:摘要:大面积掩膜(LAM)和1X光刻技术正用于大面积电子设备的制造中。其中一些设备包括但不限于:平板显示器(FPD),有源矩阵液晶显示器(AMLCD),电致发光平板显示器(ELFPD),等离子显示面板(PDP),多芯片模块(MCM)和先进的互连系统。 LAM与1X光刻一起使用可降低制造此类设备的成本。但是,在制造LAM方面存在一些挑战。第一个挑战是缺乏大面积,高质量的基材和高质量的涂层。综述了目前可用于大面积光掩模的不同类型的基底和涂层。第二个挑战来自处理用于编写LAM的商用曝光系统的局限性。在本文中,我们概述了几种可用的曝光系统及其分辨率。第三个挑战是缺乏用于处理大于14'x 14'的光掩模的系统的可用性。还讨论了用于手动和自动印版装载的处理系统。制造LAM的最终挑战是检验和质量认证。当前,没有可用于测量和量化LAM上的缺陷的可商购的度量工具。讨论了可用于认证成品LAM的计量技术及其质量保证功能。还介绍了当前的LAM可用性和规格,包括有效面积最大为20'x 18'(508 x 450毫米)的CD和2.0微米的CD。 !8

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