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Shot-size reduction of photoresist formulations

机译:减小光刻胶配方的尺寸

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Abstract: The cost of expendable chemicals in the resist process is increasing and with this the economic impetus to conserve usage. The volume of liquid resist dispensed (shot size) determines the consumption rate and disposal volumes of liquid resist. The choice of resist solvent can influence the shot volume. Three formulation factors influence the shot size: (1) the surface tension of the resist and the interfacial energy of the coating surface, (2) the viscosity of the resist formulation, and (3) the evaporation rate of the solvent. The suitable resist formulation and subsequent solvent choice should be of the lowest surface tension and lowest viscosity and be balanced by an evaporation rate which allows a minimum shot volume to be spread on the surface without significant solvent loss. Of all the solvents examined, ethyl 3-ethoxy propionate (EEP) gave the lowest shot size relative to the old resist solvent standard of 2- ethoxy ethyl acetate (ECA). !29
机译:摘要:抗蚀剂工艺中消耗的化学药品的成本正在增加,因此节约了使用的经济动力。分配的液态抗蚀剂的体积(注射量)决定了液态抗蚀剂的消耗率和处理体积。抗蚀剂溶剂的选择会影响注射量。三种配方因素会影响喷丸量:(1)抗蚀剂的表面张力和涂层表面的界面能,(2)抗蚀剂配方的粘度,以及(3)溶剂的蒸发速率。合适的抗蚀剂配方和随后的溶剂选择应具有最低的表面张力和最低的粘度,并应通过蒸发速率进行平衡,该蒸发速率可使最小的喷丸量散布在表面上而无明显的溶剂损失。在所有检查过的溶剂中,相对于旧的2-乙氧基乙酸乙酯(ECA)抗蚀剂标准,3-乙氧基丙酸乙酯(EEP)的喷丸量最低。 !29

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