Test chip fabrication of 3D optically coupled common memory for parallel processing system

摘要

Abstract: We have proposed a new three-dimensional optically coupled common memory (3D-OCC memory) to solve the problem of bus bottle neck in the multi-processor system with the shared memories. Three-dimensional-OCC memory consists of several memory layers vertically stacked and a block of data is simultaneously transferred among these memories using vertically optical interconnection. Three-dimensional-OCC memory acts as the real shared memory. Three-dimensional-OCC memory test chip has been fabricated using 2 $mu@m CMOS technology. LEDs are integrated on the silicon test chip by using a newly developed micro-bonding technology. We observed the uniform photon emission from these LEDs. In addition, the basic operation of 3D-OCC memory for optical writing/electrical reading was confirmed using this test chip. !9