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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Design of 4-kbit*4-layer optically coupled three-dimensional common memory for parallel processor system
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Design of 4-kbit*4-layer optically coupled three-dimensional common memory for parallel processor system

机译:用于并行处理器系统的4 kbit * 4层光耦合三维公用存储器的设计

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摘要

The optically coupled three-dimensional common (3D-OCC) memory is an intelligent memory for a real-time parallel processor system. It consists of a multilayered structure of two-dimensional memory with LEDs and photoconductors. The memory layers are optically coupled with each other through the LEDs and the photoconductors. Data are transferred in the vertical direction by optical coupling, while the conventional memory operations are performed in the horizontal planes. Very fast optical data transfer of 32 Gb/s/layer is confirmed in the simulation.
机译:光耦合三维通用(3D-OCC)存储器是用于实时并行处理器系统的智能存储器。它由带有LED和光电导体的二维存储器的多层结构组成。存储层通过LED和光电导体彼此光学耦合。通过光耦合在垂直方向上传输数据,而传统的存储操作在水平面中执行。在仿真中确认了非常快速的32 Gb / s /层的光学数据传输。

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