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Electromigration failure of aluminum contact junctions

机译:铝接触结的电迁移失败

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摘要

Current flow in a typical aluminum contact interface occurs only where metallic junctions form at cracks in the insulating aluminum oxide. When the total metallic conducting area is small, current density may be high enough to initiate electromigration failure. These experiments use a solid aluminum specimen having a constricted current path, representing a single metallic contact junction. Tests are conducted at two current levels, with alternating or direct current flow. There is no significant change of potential drop during an initial stable period, after which the specimens fail abruptly as the failure occurs in both AC and DC specimens.
机译:典型的铝触点界面中只有在绝缘氧化铝中的裂纹处形成金属结的地方才会发生电流流动。当总的金属导电面积较小时,电流密度可能足够高,从而引发电迁移故障。这些实验使用的固体铝样品具有狭窄的电流路径,代表单个金属接触结。测试在两个电流水平下进行,有交流电或直流电。在最初的稳定期中,电位降没有明显变化,此后,由于交流和直流试样均发生失效,试样突然失效。

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