In this paper, we present a MCM chip to chip optical interconnect layer in which optoelectronic devices are integrated onto a glass light-guiding substrate. Rather than solder bump bonding, we used the epitaxial lift-off technique for optoelectronic integration. This integration technique facilitates mixed material integration, so that we are able to choose the most cost effective and high performance material for each function in the integration. We report successful integration of emitters and detectors onto a glass substrate, demonstrating that thin-film epitaxial lift-off technology is compatible with the proposed optical interconnect system. An optical interconnection is demonstrated in which light propagating, in both a waveguide mode and substrate modes is routed by a grating to the receiving photodetector.
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