Material and device characterization to improve yield and performance

摘要

Summary form only given. In this paper, TEM characterization of thin film devices of the electronic materials in addition to thin film diamond is emphasized to solve problems of poor control over interfaces and to understand a complex set of parameters in deposition techniques which have hindered the deposition of device-quality films. Also, strategies of the fast turn-around-time for failure analysis in electronic devices are discussed with respect to efficient sample preparation, non-destructive technique, and advanced TEM analysis for nanostructural characteristics.