Material and device characterization to improve yield andperformance

摘要

Summary form only given. In this paper, TEM characterization ofthin film devices of the electronic materials in addition to thin filmdiamond is emphasized to solve problems of poor control over interfacesand to understand a complex set of parameters in deposition techniqueswhich have hindered the deposition of device-quality films. Also,strategies of the fast turn-around-time for failure analysis inelectronic devices are discussed with respect to efficient samplepreparation, non-destructive technique, and advanced TEM analysis fornanostructural characteristics