Conductive adhesives are widely used in electronics packagingapplications such as in bare chip attachment and interconnection,component fixing, display interconnection and for heat transferpurposes. This paper gives a summary of recent achievements in the useof conductive adhesives in direct flip-chip attach applications. Specialemphasis is placed on the emerging technology of the use ofanisotropically conductive adhesives as electronics interconnectionmaterials. Some flip-chip application examples on low-cost printedcircuitry are given. These examples include a flip-chip ACF bondedelectronics SBU-based six layer board for Casio's radio electronics andmemory chips assembled with the same technique in a Hitachi laptopcomputer. Current research activities and achievements to date are alsopresented. Different possible failure mechanisms for conductiveadhesives are elaborated. Finally, future challenges and developmenttrends are discussed. The paper shows that conductive adhesives play asignificant role in electronics packaging applications and moreapplications are expected in the years to come
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