Finite element modeling of printed circuit board for structuralanalysis

摘要

Printed circuit boards with unfavourable deflection have beenconsidered for better mechanical design. During the reflow process, thePCB has experienced a temperature range between ambient temperature andpeak furnace temperature. Out of plane deflection is generated due tothe thermal properties mismatch of the material composition. Thecombination of board materials and copper plating is researched forinvestigation of the cause of the trouble and for design improvements.The effects of soldering and mounted component weight are ignored due tothe input data complexity. A set of real PCBs has been exposed in areflow process and deflection data is collected for comparison. As partof the analysis procedure, a finite element model for board deflectionwas proposed