FE-simulation for polymeric packaging materials

摘要

Finite element (FE) simulations represent a useful tool toevaluate the thermomechanical behaviour of electronic packages. However,the use of the FE-method generates special difficulties, with particularregard to the proper constitutive modelling of materials used in theassembly. One more general problem in the numerical investigations ofencapsulated silicon chips is the occurrence of interfaces between thedissimilar materials. Due to the assumption of sharp interface edges andinterface crack tips, stress singularities arise which might beaccounted for only approximately in the FE-calculation. The paperintends to show solutions of these simulation difficulties, also bymeans of materials testing. The complex material behaviour is discussedfor different filled epoxy materials, with particular regard to theinfluence of filler content. A new solution method for the interfacialedge problem is briefly introduced. As an example, the pull strengthtest is used and the asymptotic solution for an interface edge ispresented