首页> 外国专利> Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

Polymer composite material, method for manufacturing the polymer composite material, capacitor package structure using the polymer composite material and method for manufacturing the capacitor package structure

机译:聚合物复合材料,该聚合物复合材料的制造方法,使用该聚合物复合材料的电容器封装结构以及该电容器封装结构的制造方法

摘要

The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.
机译:本公开提供了聚合物复合材料,用于制造聚合物复合材料的方法,使用该聚合物复合材料的电容器封装结构以及用于制造电容器封装结构的方法。该聚合物复合材料用于电容器的阴极,其中该聚合物复合材料包括聚(3,4-乙撑二氧噻吩),聚苯乙烯磺酸盐和纳米材料。聚苯乙烯磺酸盐连接在纳米材料和聚(3,4-乙撑二氧噻吩)之间,并且聚苯乙烯磺酸酯通过聚合过程结合到聚(3,4-乙撑二氧噻吩)。纳米材料的含量为0.01-1.5重量%。百分比以聚合物复合材料的重量为基准。

著录项

  • 公开/公告号US10513602B2

    专利类型

  • 公开/公告日2019-12-24

    原文格式PDF

  • 申请/专利权人 APAQ TECHNOLOGY CO. LTD.;

    申请/专利号US201715672933

  • 发明设计人 CHIEH LIN;CHING-FENG LIN;MING-TSUNG CHEN;

    申请日2017-08-09

  • 分类号H01G9/025;H01G9/042;H01G9/15;H01G9;C08L25/16;C08L65;C08F8/14;H01G9/012;C08L25/18;

  • 国家 US

  • 入库时间 2022-08-21 11:28:36

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