Probabilistic sensitivity analysis for the dynamic response of electronic systems: a study of the interactions of molding compound and die attach adhesive, with regards to package cracking

摘要

This paper presents a technique to study the sensitivity of the dynamic response of an electronic system as a function of some of its design parameters. In this approach the system parameters are defined in terms of some nominal value plus a deviatoric component. Different sensitivity measures for the electronic component response are characterized in terms of the statistical moments of the response or the coefficient of variation. This method is expected to be useful in the design, analysis and qualification of electronic components.