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Residual impurities in high purity InP grown by chemical beam epitaxy

机译:化学束外延生长的高纯度InP中的残留杂质

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In the past few years, chemical beam epitaxy (CBE) has succeeded in producing high purity InP with residual carrier concentrations in the low 10/sup 14/ cm/sup -3/ range and liquid nitrogen temperature mobilities much higher than 10/sup 5/ cm/sup 2//Vs. The authors present the results of a study where they have combined electrical, chemical, and optical measurements to identify the residual impurities in InP layers grown with different growth parameters. It is shown that S and Si are the two major residual donor impurities in InP layers grown by CBE and that they originate from the gas sources. Arsenic contamination of InP layers is a common problem in gas source systems, particularly when a single cracker cell is used for both As and P sources. However this contamination can be greatly reduced with a thorough baking prior to InP growth. The concentration of acceptors is negligible and too low to allow the identification of the residual acceptor impurities. Under optimized growth conditions, InP layers with residual carrier concentrations less than 10/sup 14/ cm/sup -3/ can be routinely grown with 77 K mobilities larger than 2 /spl times/ 10/sup 5/ cm/sup 2//Vs.
机译:在过去的几年中,化学束外延(CBE)成功生产了高纯度InP,残留载流子浓度低至10 / sup 14 / cm / sup -3 /范围内,液氮温度迁移率远高于10 / sup 5 /厘米/ sup 2 // Vs。作者介绍了一项研究的结果,他们结合了电学,化学和光学测量,以鉴定以不同生长参数生长的InP层中的残留杂质。结果表明,S和Si是CBE生长的InP层中的两个主要残留施主杂质,它们源自气源。 InP层中的砷污染是气源系统中的常见问题,特别是当单个裂解池同时用作As和P源时。但是,在InP生长之前进行彻底烘烤可以大大减少这种污染。受体的浓度可以忽略不计并且太低以至于不能识别残留的受体杂质。在优化的生长条件下,可以以大于2 / spl次/ 10 / sup 5 / cm / sup 2 //的77 K迁移率常规生长残留载流子浓度小于10 / sup 14 / cm / sup -3 /的InP层。 VS.

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