A partitioning advisor for studying the tradeoff between peripheral and area array bonding of components in multichip modules

摘要

The tradeoff between peripheral I/O format die (for wire bonding, tape automated bonding, or peripheral flip chip bonding) and area array I/O format die (for flip chip bonding) is examined as a function of partitioning a fixed functionality into a variable number of die. The comparison is made in the context of a multichip module (MCM). The automated analysis approach concurrently considers module size, thermal and electrical performance, and cost (including module level test and network) to assess the overall applicability of one bonding format over the other.