Effect of molding compound/polyimide interfacial chemistry on TSOP delamination

摘要

The effect of interfacial chemistry on plastic package delamination is investigated. The effect of cleaning treatments, molding compound types and polyimide die coating types is examined. Delamination is induced by subjecting a TSOP package with a large die to a simulated board mounting process. Stressing consists of moisture saturation at 75% RH at room temperature followed by vapor phase reflow. The best combination of materials and processes examined results in a TSOP package with no delamination after moisture saturation and vapor phase reflow.