Comparison between the Interfacial Chemistry of Metallized Polyimides and Polymide Films on Bulk Metal Substrates.

摘要

In this short overview the pertinent differences in the chemical interactions of differently prepared polymide/metal interfaces are summarized. Considered are the cases for metals deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto bulk substrates and subsequent thermal imidization (Cu), vapor deposited polyamic acid with subsequent thermal imidization (Cu, Ag, Si, Cr), and deposition of polyamic acid in the form of mono- and multilayers by Langmuir Blodgett (LB) techniques onto a silicon (100) surface. New FTIR and XPS data are presented for copper deposition onto polyimide suggesting that initial interaction leads to elimination of carbon monoxide molecules from the polymer surface. Aromatic linear polyimides are a class of organic polymers with favorable mechanical properties and dielectric properties for application in electronic devices which can easily be processed into planar films. Today they are used routinely in VSLI devices as multilevel dielectric insulation.